J-STD-003D 2022 EN 印制板的可焊性测试、J-STD-004C EN 2022 Requirements for Soldering Fluxes 助焊剂要求

J-STD-003D EN Solderability Tests for Printed Boards印制板的可焊性测试
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J-STD-003, Revision D, October 2022 - Solderability Tests for Printed Boards

This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes (PTHs). This standard is intended for use by both user and supplier.

This standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on wettability. This standard describes procedures or methods to determine the acceptable wettability of a surface …

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 J-STD-004C EN 2022 Requirements for Soldering Fluxes 助焊剂要求
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Description / Abstract:

J-STD-004, Revision C, January 2022 - Requirements for Soldering Fluxes

This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes.

Purpose

The purpose of this standard is to classify and characterize Sn-Pb and Pb-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid fl …